Figure 5. Junction capacitance versus reverse voltage

applied (typical values)

10

100

1000

1

10

100

1000

10000

VR(V)

C(pF)

F = 1 MHz

Vosc = 30 mVRMS

Tj = 25 °C

Figure 6. Relative variation of non-repetitive peak surge

forward current versus pulse duration (sinusoidal

waveform)

1.0

1.5

2.0

2.5

3.0

3.5

4.0

0.1

1.0

10.0

IFSM(tp) / IFSM(10ms)

tp(ms)

Figure 7. Relative variation of non-repetitive peak surge

forward current versus initial junction temperature

(sinusoidal waveform)

0.0

0.2

0.4

0.6

0.8

1.0

1.2

25

50

75

100

125

150

175

IFSM(Tj) / IFSM(25°C)

Tj(°C)

Figure 8. Thermal resistance junction to ambient versus

copper surface under tab (typical values, epoxy printed

board FR4, eCu = 35µm) (D²PAK HV)

0

10

20

30

40

50

60

70

80

0

5

10

15

20

25

30

35

40

SCu(cm²)

Rth(j-a) (°C/W)

STBR3012

Characteristics (curves)

DS11909 - Rev 2

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