6

JSL Series

CAUTIONS

GENERAL INFORMATION

1. ROHS Compliance

• All relays produced by FCL Components are compliant with RoHS directive 2011/65/EU, including commission

delegated directive 2015/863.

Lead free solder plating on relay terminals is Sn-3.0Ag-0.5Cu, unless otherwise specified. This material has been

verified to be compatible with PbSn assembly process.

2. Recommended lead free solder condition

•

• Recommended solder for assembly: Sn-3.0Ag-0.5Cu.

3. Moisture Sensitivity

• Moisture Sensitivity Level standard is not applicable to electromechanical relays, unless otherwise indicated.

4. Tin Whiskers

• Dipped SnAgCu solder is known as presenting a low risk to tin whisker development. No considerable

length whisker was found by our in house test.

Flow Solder Condition:

Pre-Heating:

within 90 sec.

Soldering:

Dip within 5 sec. at 255°C±5°C solder bath

Relay must be cooled by air immediately after soldering

Solder by Soldering Iron:

Soldering Iron:

30-60W

Temperature:

Duration:

Maximum 3 sec.

We highly recommend that you confirm your actual solder conditions

 ・All values mentioned in this datasheet are provided under ideal conditions. Please perform the confirmation test

before actual use.

 ・Reflow soldering is prohibited.

・Do not use relays in the atmosphere with sulfide gas, chloride gas or nitric oxide. Contact resistance may increase.

 ・Do not use silicon or silicon-containing product or materials near relays. It may cause contact failure.

Notes for latching relays

 ・Latching relays are shipped in the state set, but state may change due to shock during transportation or mounting.

Before uing the relays, it is advisable to bring the relays in necessary state (set or reset) and program a circuit sequence.

Otherwise, it will or will not operate simultaneously with power activation.

 ・Please connect relay coils according to specified polarity.

・ Do not apply voltage to both set coil and reset coil at a time.