PCA9507_1

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 01 — 7 February 2008

18 of 20

NXP Semiconductors

PCA9507

For further information on temperature profiles, refer to Application Note

AN10365

“Surface mount reflow soldering description”.

14. Abbreviations

15. Revision history

MSL: Moisture Sensitivity Level

Fig 19. Temperature profiles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Table 9.

Abbreviations

Acronym

Description

CDM

Charged Device Model

CMOS

Complementary Metal Oxide Silicon

DDC

Display Data Channel

DVD

Digital Video Disc

EDID

Extended Display Identification Data

ESD

ElectroStatic Discharge

HBM

Human Body Model

HDMI

High-Definition Multimedia Interface

Inter Integrated Circuit bus

LCD

Liquid Crystal Display

MM

Machine Model

SMBus

System Management Bus

STB

Set-Top Box

Table 10.

Revision history

Document ID

Release date

Data sheet status

Change notice

Supersedes

PCA9507_1

20080207

Product data sheet

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