LM321LVIDBVR datasheet(7/54 Pages) TI2

7 / 54 page

6.4 Thermal Information: LM321LV

THERMAL METRIC(1)

LM321LV

UNIT

DBV (SOT-23)

DCK (SC70)

5 PINS

RθJA

Junction-to-ambient thermal resistance

232.9

239.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

153.8

148.5

°C/W

RθJB

Junction-to-board thermal resistance

100.9

82.3

°C/W

ψJT

Junction-to-top characterization parameter

77.2

54.5

°C/W

ψJB

Junction-to-board characterization parameter

100.4

81.8

°C/W

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

6.5 Thermal Information: LM358LV

THERMAL METRIC(1)

LM358LV

UNIT

D (SOIC)

DGK (VSSOP)

PW (TSSOP)

DDF (SOT-23)

8 PINS

RθJA

Junction-to-ambient thermal resistance

207.9

201.2

200.7

183.7

°C/W

RθJC(top) Junction-to-case (top) thermal resistance

92.8

85.7

95.4

112.5

°C/W

RθJB

Junction-to-board thermal resistance

129.7

122.9

128.6

98.2

°C/W

ψJT

Junction-to-top characterization parameter

21.2

27.2

18.8

°C/W

ψJB

Junction-to-board characterization parameter

127.9

121.4

127.2

97.6

°C/W

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

6.6 Thermal Information: LM324LV

THERMAL METRIC(1)

LM324LV

UNIT

D (SOIC)

PW (TSSOP)

DYY (SOT-23)

14 PINS

RθJA

Junction-to-ambient thermal resistance

102.1

148.3

154.6

°C/W

RθJC(top) Junction-to-case (top) thermal resistance

56.8

68.1

86.3

°C/W

RθJB

Junction-to-board thermal resistance

58.5

92.7

67.3

°C/W

ψJT

Junction-to-top characterization parameter

20.5

16.9

9.8

°C/W

ψJB

Junction-to-board characterization parameter

58.1

91.8

67.1

°C/W

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

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LM321LV, LM324LV, LM358LV

SBOS944E – SEPTEMBER 2018 – REVISED FEBRUARY 2022

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