Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Device Comparison Table...............................................3

6 Pin Configuration and Functions...................................4

7 Specifications.................................................................. 5

7.1 Absolute Maximum Ratings........................................ 5

7.2 ESD Ratings .............................................................. 5

7.3 Recommended Operating Conditions.........................5

7.4 Thermal Information....................................................5

7.5 Electrical Characteristics.............................................6

7.6 Typical Characteristics................................................ 8

8 Detailed Description......................................................19

8.1 Overview................................................................... 19

8.2 Functional Block Diagram......................................... 19

8.3 Feature Description...................................................20

8.4 Device Functional Modes..........................................26

9 Application and Implementation.................................. 26

9.1 Application Information............................................. 26

9.2 Typical Applications.................................................. 29

10 Power Supply Recommendations..............................32

11 Layout........................................................................... 32

11.1 Layout Guidelines................................................... 32

11.2 Layout Example...................................................... 33

12 Device and Documentation Support..........................34

12.1 Device Support....................................................... 34

12.2 Documentation Support.......................................... 34

12.3 Receiving Notification of Documentation Updates..34

12.4 Support Resources................................................. 34

12.5 Trademarks.............................................................34

12.6 Electrostatic Discharge Caution..............................35

12.7 Glossary..................................................................35

13 Mechanical, Packaging, and Orderable

Information.................................................................... 35

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision C (June 2020) to Revision D (April 2022)

Page

• Changed input stage offset voltage specification for INA819DRG from 10 µV typical to 6 µV typical, and from

35 µV maximum to 30 µV maximum, in Typical Characteristics ........................................................................ 6

• Changed maximum input stage offset voltage vs temperature specification for INA819DRG from 0.4 µV/°C to

0.35 µV/°C in Typical Characteristics .................................................................................................................6

• Changed Figures 7-10 and 7-11 to correct units from nA to pA......................................................................... 8

• Changed input common-mode range calculator link from outdated Common-Mode Input Range Calculator for

Instrumentation Amplifiers to Analog Engineers Calculator..............................................................................22

Changes from Revision B (July 2019) to Revision C (June 2020)

Page

• Added DRG (WSON) package and associated content to data sheet............................................................... 1

• Added row for thermal pad to Pin Functions table .............................................................................................4

• Added bullet regarding exposed thermal pad to end of Layout Guidelines section .........................................32

Changes from Revision A (May 2019) to Revision B (July 2019)

Page

• Changed DGK (VSSOP) package from advanced information (preview) to production data (active)................ 1

Changes from Revision * (December 2018) to Revision A (April 2019)

Page

• Added 8-pin DGK (VSSOP) advanced information package and associated content to data sheet.................. 1

• Changed Applications bullets ............................................................................................................................ 1

INA819

SBOS959D – DECEMBER 2018 – REVISED APRIL 2022

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