6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Voltage

Supply, VS

6

V

Analog inputs

IN+, IN–

Differential (VIN+) – (VIN–)(2)

–26

26

V

Common-mode (VIN+) + (VIN–) / 2

–0.3

26

VPU

26

Digital outputs

Critical, warning, power valid

6

V

Timing control

26

Serial bus

Data line, SDA

(GND – 0.3)

6

V

Clock line, SCL

(GND – 0.3)

(VS + 0.3)

Current

Input, into any pin

5

mA

Open-drain, digital output

10

Temperature

Operating, TA

–40

125

°C

Junction, TJ

150

Storage, Tstg

–65

150

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

VIN+ and VIN– can have a differential voltage of –26V to +26V; however, the voltage at these pins must not exceed the range of

–0.3V to +26V.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2500

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

Machine model

±200

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Operating supply voltage

2.7

5.5

V

Operating temperature, TA

–40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

INA3221

UNIT

RGV (VQFN)

16 PINS

RθJA

Junction-to-ambient thermal resistance

36.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

42.7

°C/W

RθJB

Junction-to-board thermal resistance

14.7

°C/W

ψJT

Junction-to-top characterization parameter

0.5

°C/W

ψJB

Junction-to-board characterization parameter

14.8

°C/W

INA3221

SBOS576C – MAY 2012 – REVISED SEPTEMBER 2025

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