9 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,

generate code, and develop solutions are listed below.

9.1 Documentation Support

9.1.1 Related Documentation

For related documentation, see the following:

• Texas Instruments, CMOS Power Consumption and Cpd Calculation application note

• Texas Instruments, Designing With Logic application note

• Texas Instruments, Thermal Characteristics of Standard Linear and Logic (SLL) Packages and Devices

application note

9.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

9.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

9.4 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

9.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

9.6 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

10 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision C (August 2024) to Revision D (July 2025)

Page

• Updated the numbering format for tables, figures, and cross-references throughout the document................. 1

• Added BQB package to Package Information ...................................................................................................1

• Added BQB to Thermal Information .................................................................................................................. 4

Changes from Revision B (June 2003) to Revision C (August 2024)

Page

• Added Package Information table, Pin Functions table, ESD Ratings table, Thermal Information table, Device

Functional Modes,Application and Implementation section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section ............................................................................. 1

CD74ACT157

SCHS340D – MARCH 2003 – REVISED JULY 2025

www.ti.com

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