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L5963DN-EHT датащи(PDF) 38 Page - STMicroelectronics |
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L5963DN-EHT датащи(HTML) 38 Page - STMicroelectronics |
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38 / 49 page ![]() Thermal design L5963 38/49 DocID028553 Rev 3 It is possible to improve performance and application thermal behavior, adopting some expedients: Use the bottom layer as heat-sink, Shield inner layer tracks with ground planes, Use large paths for ground connections, instead of narrow and long paths with sharp corners, and transfer all ground connections to other layers by a proper number of vias, Place compensation network very close to the chip to reduce noise, Put coils and capacitors close to the pins, and build output path with large and short tracks. |
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