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DRV8874

SLVSF66A – AUGUST 2019 – REVISED DECEMBER 2019

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11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

For related documentation, see the following:

•

Texas Instruments, Calculating Motor Driver Power Dissipation application report

•

Texas Instruments, Current Recirculation and Decay Modes application report

•

Texas Instruments, PowerPAD™ Made Easy application report

•

Texas Instruments, PowerPAD™ Thermally Enhanced Package application report

•

Texas Instruments, Understanding Motor Driver Current Ratings application report

•

Texas Instruments, Best Practices for Board Layout of Motor Drivers application report

•

Texas Instruments, Motor Drives Layout Guide application report

•

Texas Instruments, DRV8874 Evaluation Module (EVM) tool folder

11.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

11.3 Community Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

11.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.