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VN7007ALH датащи(PDF) 28 Page - STMicroelectronics

номер детали VN7007ALH
подробное описание детали  High-side driver with CurrentSense analog feedback for automotive applications
PDF  36 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

VN7007ALH датащи(HTML) 28 Page - STMicroelectronics

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Package and PCB thermal data
VN7007ALH
28/36
DocID027958 Rev 2
6
Package and PCB thermal data
6.1
Octapak thermal data
Figure 33: Octapak on two-layers PCB (2s0p to JEDEC JESD 51-5)
Figure 34: Octapak on four-layers PCB (2s2p to JEDEC JESD 51-7)
Table 15: PCB properties
Dimension
Value
Board finish thickness
1.6 mm +/- 10%
Board dimension
77 mm x 86 mm
Board Material
FR4
Copper thickness (top and bottom layers)
0.070 mm
Copper thickness (inner layers)
0.035 mm
Thermal vias separation
1.2 mm
Thermal via diameter
0.3 mm +/- 0.08 mm
Copper thickness on vias
0.025 mm
Footprint dimension (top layer)
6.4 mm x 7 mm
Heatsink copper area dimension (bottom layer)
Footprint, 2 cm2 or 8 cm2



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