www.ti.com

EXAMPLE BOARD LAYOUT

0.07 MIN

ALL AROUND

0.07 MAX

ALL AROUND

14X (0.65)

14X (0.25)

(1.5)

(2.75)

12X (0.5)

(3.4)

(

) VIA

TYP

0.2

(1) TYP

(1.2)

TYP

VSON - 1 mm max height

DMD0014A

PLASTIC SMALL OUTLINE - NO LEAD

4221688/A 09/2014

SYMM

1

7

8

14

SYMM

LAND PATTERN EXAMPLE

SCALE:20X

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

SOLDER MASK

OPENING

SOLDER MASK

METAL UNDER

SOLDER MASK

DEFINED

METAL

SOLDER MASK

OPENING

SOLDER MASK DETAILS

NON SOLDER MASK

DEFINED

(PREFERRED)