Package and PCB thermal data

VND830LSP

20/27

Doc ID 9431 Rev 5

4

Package and PCB thermal data

4.1

PowerSO-10 thermal data

Figure 27.

PowerSO-10 PC board

Figure 28.

Rthj-amb vs PCB copper area in open box free air condition

Note:

Layout condition of Rth and Zth measurements (PCB FR4 area = 58 mm x 58 mm, PCB thickness = 2 mm, Cu thickness =

35 µm, Copper areas: from minimum pad lay-out to 8 cm2).

30

35

40

45

50

55

024

68

10

PCB Cu heatsink area (cm^2)

RTHj_amb (°C/W)

Tj-Tamb=50°C

Obsolete

Product(s)

- Obsolete

Product(s)