4.4 Thermal Information

THERMAL METRIC(1)

D (SOIC)

N (PDIP)

PW (TSSOP)

BQA (WQFN)

UNIT

14 PINS

14 PINS

14 PINS

14 PINS

R θJA

Junction-to-ambient thermal

resistance

119.9

80

145.7

91.3

°C/W

RθJC(top)

Junction-to-case (top) thermal

resistance

—

—

76.5

99.4

°C/W

RθJB

Junction-to-board thermal

resistance

—

—

102.0

61.0

°C/W

ΨJT

Junction-to-top characterization

parameter

—

—

18.8

14.5

°C/W

ΨJB

Junction-to-board

characterization parameter

—

—

100.7

60.8

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal

resistance

—

—

—

37.0

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application

note.

4.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

VCC

TA = 25°C

-40°C TO 85 °C

-55 °C TO 125°C

UNIT

MIN

MAX

MIN

MAX

MIN

MAX

VOH

VI = VIH or VIL

IOH = -50 μΑ

1.5 V

1.4

1.4

1.4

V

3 V

2.9

2.9

2.9

4.5 V

4.4

4.4

4.4

IOH = -4 mA

3 V

2.58

2.48

2.4

IOH = -24 mA

4.5 V

3.94

3.8

3.7

IOH = -50 mA(1)

5.5 V

3.85

IOH = -75 mA(1)

5.5 V

3.85

VOL

VI = VIH or VIL

IOL = 50 μA

1.5 V

0.1

0.1

0.1

V

3 V

0.1

0.1

0.1

4.5 V

0.1

0.1

0.1

IOL = 12 mA

3 V

0.36

0.44

0.5

IOL = 24 mA

4.5 V

0.36

0.44

0.5

IOL = 50 mA(1)

5.5 V

1.65

IOL = 75 mA(1)

5.5 V

1.65

II

VI = VCC or GND

5.5 V

±0.1

±1

±1

μA

ICC

VI = VCC or GND,

IO = 0

5.5 V

4

40

80

μA

Ci

10

10

10

PF

(1)

Test one output at a time, not exceeding 1-second duration. Measurement is made by forcing indicated current and measuring voltage

to minimize power dissipation. Test verifies a minimum 50-Ω transmission-line drive capability at 85°C and 75-Ω transmission-line drive

capability at 125°C.

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CD54AC02, CD74AC02

SCHS304E – JANUARY 2001 – REVISED APRIL 2025

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