Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Pin Configuration and Functions...................................4

6 Specifications.................................................................. 5

6.1 Absolute Maximum Ratings........................................ 5

6.2 ESD Ratings............................................................... 5

6.3 Recommended Operating Conditions.........................5

6.4 Thermal Information....................................................6

6.5 Power Ratings.............................................................6

6.6 Insulation Specifications............................................. 7

6.7 Safety-Related Certifications...................................... 8

6.8 Safety Limiting Values.................................................8

6.9 Electrical Characteristics.............................................9

6.10 Switching Characteristics........................................10

6.11 Timing Diagram....................................................... 10

6.12 Insulation Characteristics Curves............................11

6.13 Typical Characteristics............................................ 12

7 Detailed Description......................................................19

7.1 Overview................................................................... 19

7.2 Functional Block Diagram......................................... 19

7.3 Feature Description...................................................19

7.4 Device Functional Modes..........................................21

8 Application and Implementation.................................. 22

8.1 Application Information............................................. 22

8.2 Typical Application.................................................... 22

8.3 Best Design Practices...............................................25

8.4 Power Supply Recommendations.............................25

8.5 Layout....................................................................... 26

9 Device and Documentation Support............................27

9.1 Documentation Support............................................ 27

9.2 Receiving Notification of Documentation Updates....27

9.3 Support Resources................................................... 27

9.4 Trademarks...............................................................27

9.5 Electrostatic Discharge Caution................................27

9.6 Glossary....................................................................27

10 Mechanical, Packaging, and Orderable

Information.................................................................... 27

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from March 14, 2023 to April 24, 2023 (from Revision F (April 2020) to Revision G

(April 2023))

Page

• Changed document title......................................................................................................................................1

• Changed Features section: Changed, deleted, and reorganized bullets............................................................1

• Changed isolation standard from DIN VDE V 0884-11 (VDE V 0884-10) to DIN EN IEC 60747-17 (VDE

0884-17) and updated the Insulation Specifications and Safety-Related Certifications tables accordingly....... 1

• Deleted last bullet from Applications section...................................................................................................... 1

• Changed Description section to include common-mode decoupling capacitors as a known best practice........1

• Changed pin names VINP to INP, VINN to INN, VOUTP to OUTP, and VOUTN to OUTN throughout

document............................................................................................................................................................ 4

• Changed Description column and added footnotes to Pin Functions table........................................................ 4

• Changed CDM ESD standard from JESD22-C101 to JDEC JS-002 .................................................................5

• Changed PD from 81.4 mW to 99 mW............................................................................................................... 6

• Changed PD1 (VDD1 = 3.3 V) from 24.85 mW to 31 mW.................................................................................6

• Changed PD1 (VDD1 = 5.5 V) from 45.65 mW to 54 mW.................................................................................6

• Changed PD2 (VDD2 = 3.3 V) from 20.16 mW to 26 mW..................................................................................6

• Changed PD2 (VDD2 = 5.5 V) from 35.75 mW to 45 mW..................................................................................6

• Changed DTI from ≥0.027 mm to ≥0.021 mm in Insulation Specifications table................................................ 7

• Changed IDD1 (3.0 V ≤ VDD1 ≤ 3.6 V) from 5.0 mA (typ) / 6.9 mA (max) to 6.3 mA (typ) / 8.5 mA (max)........9

• Changed IDD1 (4.5 V ≤ VDD1 ≤ 5.5 V) from 5.9 mA (typ) / 8.3 mA (max) to 7.2 mA (typ) / 9.8 mA (max)........9

• Changed IDD2 (3.0 V ≤ VDD2 ≤ 3.6 V) from 4.4 mA (typ) / 5.6 mA (max) to 5.3 mA (typ) / 7.2 mA (max)........9

• Changed IDD2 (4.5 V ≤ VDD2 ≤ 5.5 V) from 4.8 mA (typ) / 6.5 mA (max) to 5.9 mA (typ) / 8.1 mA (max)........9

• Changed Timing Diagram section.................................................................................................................... 10

• Changed Overview section...............................................................................................................................19

• Changed Functional Block Diagram image...................................................................................................... 19

• Changed the Analog Input section....................................................................................................................19

• Added the Isolation Channel Signal Transmission section............................................................................... 20

• Added Analog Output section, deleted Fail-Safe Output section......................................................................21

• Changed Device Functional Modes section..................................................................................................... 21

AMC1301

SBAS667G – APRIL 2016 – REVISED APRIL 2023

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