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TS4962 датащи(PDF) 41 Page - STMicroelectronics |
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TS4962 датащи(HTML) 41 Page - STMicroelectronics |
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41 / 44 page ![]() DocID10968 Rev 9 41/44 TS4962 Package information 44 Figure 71. DFN8 3 x 3 exposed pad package mechanical drawing (pitch 0.65 mm) Table 12. DFN8 3 x 3 exposed pad package mechanical data (pitch 0.65 mm) Note: 1 The pin 1 identifier must be visible on the top surface of the package by using an indentation mark or other feature of the package body. Exact shape and size of this feature are optional. 2 The dimension L does not conform with JEDEC MO-248, which recommends 0.40+/-0.10 mm. For enhanced thermal performance, the exposed pad must be soldered to a copper area on the PCB, acting as a heatsink. This copper area can be electrically connected to pin 7 or left floating. Ref. Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.50 0.60 0.65 0.020 0.024 0.026 A1 0.02 0.05 0.0008 0.002 A3 0.22 0.009 b 0.25 0.30 0.35 0.010 0.012 0.014 D 2.85 3.00 3.15 0.112 0.118 0.124 D2 1.60 1.70 1.80 0.063 0.067 0.071 E 2.85 3.00 3.15 0.112 0.118 0.124 E2 1.10 1.20 1.30 0.043 0.047 0.051 e 0.65 0.026 L 0.50 0.55 0.60 0.020 0.022 0.024 ddd 0.08 0.003 |
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