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AM263P4 датащи(PDF) 87 Page - Texas Instruments

номер детали AM263P4
подробное описание детали  AM263Px Sitara™ Microcontrollers with Optional Flash-in-Package
PDF  168 Pages
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производитель  TI2 [Texas Instruments]
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AM263P4 датащи(HTML) 87 Page - Texas Instruments

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6.10 Thermal Resistance Characteristics
This section provides the thermal resistance characteristics used on this device.
For reliability and operability concerns, the maximum junction temperature of the device has to be at or below
the TJ value identified in Section 6.5, Recommended Operating Conditions.
6.10.1 Package Thermal Characteristics
It is recommended to perform thermal simulations at the system level with the worst-case device power consumption.
PARAMETER
DESCRIPTION
℃/W(1) (2)
AIR FLOW (m/s)
(3)
RΘJC
Junction-to-case
5.4
N/A
RΘJB
Junction-to-board
5.3
N/A
RΘJA
Junction-to-free air
18.7
0
RΘJA
Junction-to-moving air
12.4
1
11.2
2
10.6
3
ΨJT
Junction-to-package top
0.12
0
0.35
1
0.47
2
0.56
3
ΨJB
Junction-to-board
5.1
0
4.6
1
4.6
2
4.5
3
(1)
These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a
JEDEC defined 1S0P system) and change based on environment as well as application. For more information, see these EIA/JEDEC
standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Packages
(2)
℃/W = degrees Celsius per watt
(3)
m/s = meters per second
www.ti.com
AM263P4, AM263P2, AM263P4-Q1, AM263P2-Q1
SPRSP81D – OCTOBER 2023 – REVISED MAY 2025
Copyright © 2025 Texas Instruments Incorporated
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Product Folder Links: AM263P4 AM263P2 AM263P4-Q1 AM263P2-Q1



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