AP7372

Document number: DS46597 Rev. 3 - 2

3 of 15

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May 2025

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AP7372

Absolute Maximum Ratings (Note 4) (@TA = +25°C, unless otherwise specified.)

Symbol

Parameter

Rating

Unit

VIN

Supply Input Voltage

-0.3 to 24

V

VOUT

Regulated Output Voltage

-0.3 to VIN

V

VEN

Enable Pin Voltage

-0.3 to 26

V

VSENSE/ADJ

Sense and Adjustable Voltage

-0.3 to 6

V

VSS

Soft-Start Voltage

-0.3V to VIN or +6V (whichever is less)

V

IOUT

Output Current

Internally limited

mA

TLEAD

Lead Temperature (Soldering, 10sec)

+260

°C

TJ

Operating Junction Temperature

+150

°C

TA

Operating Ambient Temperature

-40 to +85

°C

TSTG

Storage Temperature Range

-40 to +150

°C

HBM

ESD (Human Body Model)

2000

V

CDM

ESD (Change Device Model)

1000

V

Note:

4. a). Stresses greater than those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied.

Exposure to Absolute Maximum Ratings for extended periods can affect device reliability.

b). Ratings apply to ambient temperature at +25°C. The JEDEC STD.51 High-K board design used to derive this data was a 3inch x 3inch multilayer

board with 1oz. internal power and ground planes and 2oz. copper traces on the top and bottom of the board.

Recommended Operating Conditions

Symbol

Parameter

Min

Max

Unit

VIN

Supply Input Voltage

2.7

20

V

VEN

Enable Pin Voltage

0

20

V

VOUT

Supply Output Voltage

1.2

VIN - VDO

V

IOUT

Output Current

0

200

mA

TJ

Operating Junction Temperature

-40

+125

°C

CMIN (Note 5)

Input and Output Minimum Capacitance

1.5

—

µF

COUT(MAX)

Output Maximum Capacitance

—

22

µF

RESR

Capacitor Effective Series Resistance (ESR)

0.001

0.3

Ω

Note:

5. The minimum input and output capacitance must be greater than 1.5

μF over the full range of operating conditions. The full range of operating conditions

in the application must be considered during device selection to ensure that the minimum capacitance specification is met. X7R and X5R type capacitors

are recommended, whereas Y5V and Z5U capacitors are not recommended for use with any LDO.

Package Thermal Information

Thermal Metric (Note 6)

U-WLB1012-6 (Type A1)

Unit

RθJA

Junction-to-Ambient Thermal Resistance

163.76

°C/W

RθJC(top)

Junction-to-Case (Top) Thermal Resistance

46.8

°C/W

RθJB

Junction-to-Board Thermal Resistance

28.29

°C/W

ψJT

Junction-to-Top Characterization Parameter

2.84

°C/W

ψJB

Junction-to-Board Characterization Parameter

28.29

°C/W

RθJC(bot)

Junction-to-Case (Bottom) Thermal Resistance

32.8

°C/W

Note:

6. Ratings apply to ambient temperature at +25°C. The JEDEC STD.51 High-K board design used to derive this data was a 3inch × 3inch multilayer board

with 1oz. internal power and ground planes and 2oz. copper traces on the top and bottom of the board.