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EXAMPLE BOARD LAYOUT

0.05 MAX

ALL AROUND

0.05 MIN

ALL AROUND

6X (1.3)

6X (0.3)

5X (0.5)

(9.6)

(R0.05) TYP

(2.8)

(1.3)

SSOP - 2.65 mm max height

DFP0012A-C01

SMALL OUTLINE PACKAGE

4232170/A 08/2025

NOTES: (continued)

5. Publication IPC-7351 may have alternate designs.

6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 10X

SYMM

SYMM

1

6

7

12

15.000

METAL

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

SOLDER MASK

OPENING

EXPOSED METAL

EXPOSED METAL

SOLDER MASK DETAILS

NON-SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK

DEFINED