OPA211AI datasheet(2/17 Pages) TI

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ABSOLUTE MAXIMUM RATINGS

(1)

OPA211

OPA2211

SBOS377D – OCTOBER 2006 – REVISED FEBRUARY 2008

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

Over operating free-air temperature range (unless otherwise noted).

VALUE

UNIT

Supply Voltage

VS = (V+) – (V–)

Input Voltage

(V–) – 0.5 to (V+) + 0.5

Input Current (Any pin except power-supply pins)

±10

Output Short-Circuit(2)

Continuous

Operating Temperature

(TA)

–55 to +150

°C

Storage Temperature

(TA)

–65 to +150

°C

Junction Temperature

(TJ)

200

°C

Human Body Model (HBM)

3000

ESD Ratings

Charged Device Model (CDM)

1000

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not supported.

(2)

Short-circuit to VS/2 (ground in symmetrical dual supply setups), one amplifier per package.

PACKAGE/ORDERING INFORMATION(1)

PACKAGE

PRODUCT

PACKAGE-LEAD

SINGLE

SHUTDOWN

DUAL

DESIGNATOR

MARKING

Standard Grade

DFN-8 (3

×3mm)(2)

DRG

OBDQ

OPA211AI

MSOP-8(2)

DGK

OBCQ

A TI OPA

OPA211AI

SO-8

211

DFN-8 (3

×3mm)(3)

DRG

OBHQ

OPA2211AI

A TI OPA

SO-8 PowerPAD(3)

DDA

2211

High Grade(3)

DFN-8 (3

×3mm)

DRG

OBDQ

MSOP-8

DGK

OBCQ

OPA211I

TI OPA

SO-8

211

DFN-8 (3

×3mm)

DRG

OBHQ

OPA2211I

TI OPA

SO-8 PowerPAD

DDA

2211

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Available Q2, 2008.

(3)

Available Q3, 2008.

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