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OPA211 датащи(PDF) 2 Page - Texas Instruments

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номер детали OPA211
подробное описание детали  1.1nV/Noise, Low Power, Precision Operational Amplifier in Tiny DFN-8 Package
PDF  9 Pages
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производитель  TI [Texas Instruments]
домашняя страница  http://www.ti.com
Logo TI - Texas Instruments

OPA211 датащи(HTML) 2 Page - Texas Instruments

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ABSOLUTE MAXIMUM RATINGS
(1)
OPA211
OPA2211
SBOS377A – OCTOBER 2006 – REVISED FEBRUARY 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
Over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT
Supply Voltage
±20
V
Input Voltage
(V–) – 0.7 to (V+) + 0.7
V
Input Current
±10
mA
Output Short-Circuit(2)
Continuous
Operating Temperature
–55 to +150
°C
Storage Temperature
–65 to +150
°C
Junction Temperature
+150
°C
(1)
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
(2)
Short-circuit to ground, one amplifier per package.
PACKAGE/ORDERING INFORMATION(1)
PACKAGE
PRODUCT
PACKAGE-LEAD
SINGLE
ENABLE
DUAL
DESIGNATOR
PACKAGE MARKING
Standard Grade
DFN-8 (3
×3mm)(2)
ü
ü
DRG
TBD
OPA211A
MSOP-8(2)
ü
ü
DCK
TBD
OPA211A
SO-8
ü
D
TBD
DFN-8 (3
×3mm)(2)
ü
DRG
TBD
OPA2211A
MSOP-8(2)
ü
DCK
TBD
High Grade
DFN-8 (3
×3mm)(2)
ü
ü
DRG
TBD
OPA211I
MSOP-8(2)
ü
ü
DCK
TBD
SO-8
ü
D
TBD
DFN-8 (3
×3mm)(2)
ü
DRG
TBD
OPA2211I
MSOP-8(2)
ü
DCK
TBD
(1)
For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2)
Available Q4, 2007.
2
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