ESDALC6V1Px

Package information

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Figure 12.

SOT-666IP footprint (dimensions in mm)

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Table 5.

SOT-666IP dimensions

Ref.

Dimensions

Millimeters

Inches

Min.

Typ.

Max.

Min.

Typ.

Max.

A

0.45

0.60

0.018

0.024

A3

0.08

0.18

0.003

0.007

b

0.17

0.34

0.007

0.013

b1

0.19

0.27

0.34

0.007 0.011 0.013

D

1.50

1.70

0.059

0.067

E

1.50

1.70

0.059

0.067

E1

1.10

1.30

0.043

0.051

e0.50

0.020

L1

0.19

0.007

L2

0.10

0.30

0.004

0.012

L3

0.10

0.004

L4

0.60

0.024

D

b

L3

L1

L4

e

b1

E1

L2

E

A

A3