IN

EN

GND

OUT

OUTPUT

0.47 PF

0.47 PF

INPUT

ENABLE

GND

LP5900

12

LP5900

SNVS358R – JULY 2005 – REVISED JUNE 2016

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Product Folder Links: LP5900

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Copyright © 2005–2016, Texas Instruments Incorporated

8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

8.1 Application Information

The LP5900 is a linear regulator capable of supplying a 150-mA output current. Designed to meet the

requirements of RF and nalog circuits, the device provides low noise, high PSRR, low quiescent current, and low

line transient response figures. Using new innovative design techniques the LP5900 offers class-leading device

noise performance and is designed to work with 0.47-

μF input and output ceramic capacitors (no bypass

capacitor is required).

8.2 Typical Application

Figure 16 shows the typical application circuit for the LP5900. Input and output capacitances may need to be

increased above the 0.47-

μF minimum for some applications.

Figure 16. LP5900 Typical Application

8.2.1 Design Requirements

DESIGN PARAMETER

MIN

MAX

UNITS

Input voltage range

2.5

5.5

V

Output voltage

2.8

V

Output current

150

mA

Output capacitor range

0.47

10

μF

Input/Output capacitor ESR range

5

500

m

Ω

8.2.2 Detailed Design Procedure

8.2.2.1 Power Dissipation

The permissible power dissipation for any package is a measure of the capability of the device to pass heat from

the power source, the junctions of the device, to the ultimate heat sink, the ambient environment. Thus the power

dissipation is dependent on the ambient temperature and the thermal resistance across the various interfaces

between the die and ambient air. As stated in Recommended Operating Conditions, the allowable power

dissipation for the device in a given package can be calculated using Equation 1: