LP3995

SNVS179F – FEBRUARY 2003 – REVISED SEPTEMBER 2015

www.ti.com

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

MIN

MAX

UNIT

Input voltage, VIN

–0.3

6.5

V

Output voltage

–0.3

(VIN + 0.3 V) to 6.5

V

Enable input voltage

–0.3

6.5

V

Junction temperature

150

°C

Continuous power dissipation(4)

Internally limited

Storage temperature, Tstg

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office / Distributors for availability and

specifications.

(4)

In applications where high power dissipation and/or poor thermal resistance is present, the maximum ambient temperature may have to

be derated. Maximum ambient temperature (TA(MAX)) is dependant on the maximum operating junction temperature (TJ(MAX-OP)), the

maximum power dissipation (PD(MAX)), and the junction-to-ambient thermal resistance in the application (RθJA). This relationship is given

by: TA(MAX) = TJ(MAX-OP) − (PD(MAX) × RθJA).

6.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V(ESD)

Electrostatic discharge

V

Machine model

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input voltage, VIN

2.5

6

V

Enable input voltage

0

6

V

Junction temperature

−40

125

°C

Ambient temperature(1)

−40

85

°C

(1)

In applications where high power dissipation and/or poor thermal resistance is present, the maximum ambient temperature may have to

be derated. Maximum ambient temperature (TA(MAX)) is dependant on the maximum operating junction temperature (TJ(MAX-OP)), the

maximum power dissipation (PD(MAX)), and the junction-to-ambient thermal resistance in the application (RθJA). This relationship is given

by: TA(MAX) = TJ(MAX-OP) − (PD(MAX) × RθJA).

4

Submit Documentation Feedback

Copyright © 2003–2015, Texas Instruments Incorporated

Product Folder Links: LP3995