LMV721

0

DBV or DCK PACKAGE

(TOP VIEW)

LMV722

0

D, DGK, OR DRG PACKAGE

(TOP VIEW)

1

2

3

4

8

7

6

5

VCC+

2OUT

2IN−

2IN+

1OUT

1IN−

1IN+

VCC−

1

2

3

5

4

OUT

VCC−

IN+

VCC+

IN−

LMV721

LMV722

www.ti.com

SLOS470C – JUNE 2005 – REVISED SEPTEMBER 2010

10-MHz LOW-NOISE LOW-VOLTAGE LOW-POWER

OPERATIONAL AMPLIFIERS

Check for Samples: LMV721, LMV722

1

FEATURES

•

Power-Supply Voltage Range: 2.2 V to 5.5 V

•

Low Supply Current: 930 mA/Amplifier at 2.2 V

•

High Unity-Gain Bandwidth: 10 MHz

•

Rail-to-Rail Output Swing

–

600-

Ω Load: 120 mV From Either Rail at

2.2 V

–

2-k

Ω Load: 50 mV From Either Rail at 2.2 V

•

Input Common-Mode Voltage Range Includes

Ground

•

Input Voltage Noise: 9 nV/

√Hz at f = 1 kHz

APPLICATIONS

•

Cellular and Cordless Phones

•

Active Filter and Buffers

•

Laptops and PDAs

•

Battery Powered Electronics

DESCRIPTION/ORDERING INFORMATION

The LMV721 (single) and LMV722 (dual) are low-noise low-voltage low-power operational amplifiers that can be

designed into a wide range of applications. The LMV721 and LMV722 have a unity-gain bandwidth of 10 MHz, a

slew rate of 5 V/ms, and a quiescent current of 930 mA/amplifier at 2.2 V.

The LMV721 and LMV722 are designed to provide optimal performance in low-voltage and low-noise systems.

They provide rail-to-rail output swing into heavy loads. The input common-mode voltage range includes ground,

and the maximum input offset voltage are 3.5 mV (over recommended temperature range) for the devices. Their

capacitive load capability is also good at low supply voltages. The operating range is from 2.2 V to 5.5 V.

ORDERING INFORMATION(1)

TA

PACKAGE(2)

ORDERABLE PART NUMBER

TOP-SIDE MARKING(3)

Reel of 3000

LMV721IDCKR

SC-70 – DCK

RK_

Single

Reel of 250

LMV721IDCKT

SOT-23 – DBV

Reel of 3000

LMV721IDBVR

RBF_

–40°C to 105°C

Reel of 2500

LMV722IDR

SOIC – D

MV722I

Tube of 75

LMV722ID

Dual

VSSOP – DGK

Reel of 2500

LMV722IDGKR

R6_

QFN – DRG

Reel of 2500

LMV722IDRGR

ZYY

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(3)

DBV/DCK/DGK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Copyright © 2005–2010, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.