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LMV641

SNOSAW3D – SEPTEMBER 2007 – REVISED AUGUST 2016

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(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not guaranteed. For ensured specifications and the test

conditions, see the Electrical Characteristics Tables.

(2)

If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office / Distributors for availability and

specifications.

(3)

The maximum power dissipation is a function of TJ(MAX, RθJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) - TA)/ RθJA. All numbers apply for packages soldered directly onto a PC board.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Differential input VID

±0.3

±0.3

V

Supply voltage (VS = V

+ - V−)

13.2

V

Input and output pin voltage

(V−

−0.3)

V+ +0.3

V

Junction temperature (3)

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), (1)

±2000

V

Machine model (MM)

±200

(1)

The maximum power dissipation is a function of TJ(MAX, RθJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) - TA)/ RθJA. All numbers apply for packages soldered directly onto a PC board.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Temperature (1)

–40

125

°C

Supply voltage (VS = V

+ – V−)

2.7

12

V

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2)

The maximum power dissipation is a function of TJ(MAX, RθJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) - TA)/ RθJA. All numbers apply for packages soldered directly onto a PC board.

6.4 Thermal Information

THERMAL METRIC(1)

LMV641

UNIT

DBV (SOT-23)

DCK (SC70)

D (SOIC)

5 PINS

5 PINS

8 PINS

RθJA

(2)

Junction-to-ambient thermal resistance

325

456

166

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

178.1

121.8

93.6

°C/W

RθJB

Junction-to-board thermal resistance

60.8

68.9

90.9

°C/W

ψJT

Junction-to-top characterization parameter

57.7

5.3

38.4

°C/W

ψJB

Junction-to-board characterization parameter

60.2

68.1

90.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

n/a

n/a

°C/W