AD6653-125EBZ datasheet(13/80 Pages) AD

13 / 80 page

AD6653

Rev. 0 | Page 13 of 80

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

Rating

ELECTRICAL

AVDD, DVDD to AGND

−0.3 V to +2.0 V

DRVDD to DRGND

−0.3 V to +3.9 V

AGND to DRGND

−0.3 V to +0.3 V

VIN+A/VIN+B, VIN−A/VIN−B to AGND

−0.3 V to AVDD + 0.2 V

CLK+, CLK− to AGND

−0.3 V to +3.9 V

SYNC to AGND

−0.3 V to +3.9 V

VREF to AGND

−0.3 V to AVDD + 0.2 V

SENSE to AGND

−0.3 V to AVDD + 0.2 V

CML to AGND

−0.3 V to AVDD + 0.2 V

RBIAS to AGND

−0.3 V to AVDD + 0.2 V

CSB to AGND

−0.3 V to +3.9 V

SCLK/DFS to DRGND

−0.3 V to +3.9 V

SDIO/DCS to DRGND

−0.3 V to DRVDD + 0.3 V

SMI SDO/OEB to DRGND

−0.3 V to DRVDD + 0.3 V

SMI SCLK/PDWN to DRGND

−0.3 V to DRVDD + 0.3 V

SMI SDFS to DRGND

−0.3 V to DRVDD + 0.3 V

D0A/D0B through D11A/D11B

to DRGND

−0.3 V to DRVDD + 0.3 V

FD0A/FD0B through FD3A/FD3B

to DRGND

−0.3 V to DRVDD + 0.3 V

DCOA/DCOB to DRGND

−0.3 V to DRVDD + 0.3 V

ENVIRONMENTAL

Operating Temperature Range

(Ambient)

−40°C to +85°C

Maximum Junction Temperature

Under Bias

150°C

Storage Temperature Range

(Ambient)

−65°C to +125°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL CHARACTERISTICS

The exposed paddle must be soldered to the ground plane for

the LFCSP package. Soldering the exposed paddle to the customer

board increases the reliability of the solder joints and maximizes

the thermal capability of the package.

Table 7. Thermal Resistance

Package

Type

Airflow

Velocity

(m/s)

θJA1,2

θJC1,3

θJB1,4

Unit

18.8

0.6

6.0

°C/W

1.0

16.5

°C/W

64-Lead LFCSP

9 mm × 9 mm

(CP-64-3)

2.0

15.8

°C/W

1 Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.

2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).

3 Per MIL-Std 883, Method 1012.1.

4 Per JEDEC JESD51-8 (still air).

Typical θJA is specified for a 4-layer PCB with a solid ground

plane. As shown, airflow increases heat dissipation, which

reduces θJA. In addition, metal in direct contact with the

package leads from metal traces, through holes, ground, and

power planes, reduces the θJA.

ESD CAUTION

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