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LM3464 датащи(PDF) 3 Page - Texas Instruments

номер детали LM3464
подробное описание детали  LED Driver with Dynamic Headroom Control and Thermal Control Interfaces
PDF  34 Pages
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производитель  TI2 [Texas Instruments]
домашняя страница  https://www.ti.com
Logo TI2 - Texas Instruments

LM3464 датащи(HTML) 3 Page - Texas Instruments

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LM3464, LM3464A
www.ti.com
SNVS652F – APRIL 2010 – REVISED MAY 2013
PIN DESCRIPTIONS (continued)
Pin
Name
Description
Application Information
19
DR1
Channel 1 drain sense input
This pin senses the drain voltage of the external MOSFET of channel 1 to
facilitate DHC operation and fault detection.
20
SE4
Channel 4 sense input
Connect to an external sense resistor to define the Channel 4 LED current.
21
GD4
Channel 4 gate driver output
Connect to the gate of external NMOS to control the channel 4 LED current.
22
PGND
Power Ground
Ground for power circuitry. Reference point for all stated voltages. Must be
externally connected to EP and AGND
23
GD3
Channel 3 gate driver output
Connect to the gate of external NMOS to control the channel 3 LED current.
24
SE3
Channel 3 sense input
Connect to an external sense resistor to define the Channel 3 LED current.
25
GD2
Channel 2 gate driver output
Connect to the gate of external NMOS to control the channel 2 LED current.
26
SE2
Channel 2 sense input
Connect to an external sense resistor to define the Channel 2 LED current.
27
GD1
Channel 1 gate driver output
Connect to the gate of external NMOS to control the channel 1 LED current.
28
SE1
Channel 1 sense input
Connect to an external sense resistor to define the Channel 1 LED current.
EP
EP
Thermal Pad (Power Ground)
Used to dissipate heat from the package during operation. Must be electrically
connected to PGND external to the package.
Copyright © 2010–2013, Texas Instruments Incorporated
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Product Folder Links: LM3464 LM3464A



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