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EXAMPLE BOARD LAYOUT

(9.75)

R0.05 TYP

0.07 MAX

ALL AROUND

0.07 MIN

ALL AROUND

(9.3)

14X (1.27)

R0.05 TYP

16X (1.65)

16X (0.6)

14X (1.27)

16X (2)

16X (0.6)

4221009/B 07/2016

SYMM

SOIC - 2.65 mm max height

DW0016B

SOIC

SYMM

SEE

DETAILS

1

8

9

16

SYMM

HV / ISOLATION OPTION

8.1 mm CLEARANCE/CREEPAGE

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

SOLDER MASK DETAILS

OPENING

SOLDER MASK

METAL

SOLDER MASK

DEFINED

SCALE:4X

LAND PATTERN EXAMPLE

SYMM

1

8

9

16

IPC-7351 NOMINAL

7.3 mm CLEARANCE/CREEPAGE

SEE

DETAILS

ISO3080, ISO3082, ISO3086, ISO3088

SLOS581J – MAY 2008 – REVISED AUGUST 2023

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Product Folder Links: ISO3080 ISO3082 ISO3086 ISO3088