ISO7320C, ISO7320FC, ISO7321C, ISO7321FC

SLLSEK8C – JANUARY 2015 – REVISED APRIL 2015

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6 Specifications

6.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

Supply voltage, VCC1 , VCC2

(2)

–0.5

6

V

Voltage (2)

INx, OUTx

–0.5

VCC+ 0.5

(3)

V

Output current, IO

±15

mA

Junction temperature, TJ

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal and are peak voltage values.

(3)

Maximum voltage must not exceed 6 V.

6.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±4000

VESD

V

Charged device model (CDM), per JEDEC specification JESD22-C101(2)

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN

TYP

MAX

UNIT

VCC1, VCC2

Supply voltage

3

5.5

V

IOH

High-level output current

–4

mA

IOL

Low-level output current

4

mA

VIH

High-level input voltage

2

5.5

V

VIL

Low-level input voltage

0

0.8

V

tui

Input pulse duration

40

ns

1 / tui

Signaling rate

0

25

Mbps

TJ

(1)

Junction temperature

136

°C

TA

Ambient temperature

-40

25

125

°C

(1)

To maintain the recommended operating conditions for TJ, see the Thermal Information table.

6.4 Thermal Information

D PACKAGE

THERMAL METRIC(1)

UNIT

(8) PINS

RθJA

Junction-to-ambient thermal resistance

121

RθJCtop

Junction-to-case (top) thermal resistance

67.9

RθJB

Junction-to-board thermal resistance

61.6

°C/W

ψJT

Junction-to-top characterization parameter

21.5

ψJB

Junction-to-board characterization parameter

61.1

RθJCbot

Junction-to-case (bottom) thermal resistance

N/A

PD (ISO7320)

Maximum power dissipation by ISO7320

56

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15

PD1 (ISO7320)

Maximum power dissipation by side-1 of ISO7320

pF, Input a 12.5 MHz 50% duty-cycle square

15

mW

wave

PD2 (ISO7320)

Maximum power dissipation by side-2 of ISO7320

41

PD (ISO7321)

Maximum power dissipation by ISO7321

67

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15

PD1 (ISO7321)

Maximum power dissipation by side-1 of ISO7321

pF, Input a 12.5 MHz 50% duty-cycle square

33.5

mW

wave

PD2 (ISO7321)

Maximum power dissipation by side-2 of ISO7321

33.5

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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