B

B

1

SINCE 1981

SIDE- LOOK PACKAGE

PIN PHOTO DIODE

Features

1. Wide receiving angle

2. Linear response vs. irradiance

3. Fast switching time

4. Side-looking Package ideal for space

Limited applications

5. Lens Appearance: Water Clear

Description

The BPD-RQ03DV-1 device consists

of a PIN silicon photodiode molded in

a clear epoxy package which allows

spectral response from visible to

infrared light wavelengths. The wide

receiving angle provides relatively even

reception over a large area. The

side-looking package is designed for

easy PC board mounting. This photodiode

is mechanically and spectrally matched to

BRIGHT’s GaAs and GaAlAs series of infrared

emitting diodes.

Absolute Maximum Ratings(Ta=25℃)

Parameter

Maximum Rating

Unit

Power Dissipation

100

mW

Reverse Breakdown Voltage

60V

Operating Temperature

-45℃~+85℃

Storage Temperature Range

-45℃~+100℃

Lead Soldering Temperature

260℃ for 5 seconds

●

Package Dimensions:

NOTES:

1.All dimensions are in millimeters (inches).

2.Tolerance is ±0.25mm (0.01”) unless otherwise specified.

3.Lead spacing is measured where the leads emerge from the package

4. Specifications are subject to change without notice

Ver.2.0

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