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Sep. 05, 2024 V.2

Melf Metal Film Resistors

4

9

Product Specification

MMP

Through Hole Resistors

ELECTRICAL CHARACTERISTICS

CHARACTERISTICS

MMP100

MMP200

Power Rating at 70 °C

1W

2W

Maximum Working Voltage

350V

350V

Maximum Overload Voltage

700V

700V

Voltage Proof on Insulation

500V

500V

Resistance Range

1Ω ~ 1MΩ & 0Ω for E24 & E96 series value

Operating Temp. Range

- 55°C to +155°C

Temperature Coefficient

±50ppm/°C, ±100ppm/°C

Note: For resistance value out of above range is by request.

TEST AND REQUIRMENTS

TEST

TEST METHOD

PROCEDURE

APPRAISE

Short Time Overload

IEC 60115-1 4.13

2.5 times RCWV for 5 sec.(Not more than

maximum overload voltage)

±0.5%+0.05Ω

Voltage Proof on

Insulation

IEC 60115-1 4.7

In V-Block for 60 sec. test voltage as

above table

No Breakdown

Temperature Coefficient

IEC 60115-1 4.8

Between -55°C to +155°C

By Type

Insulation Resistance

IEC 60115-1 4.6

In V-Block for 60 sec.

>10,000MΩ

Solderability

IEC 60115-1 4.17

245±5°C for 3±0.5 Sec.

95% Min. coverage

Solvent Resistance of

Marking

IEC 60115-1 4.30

IPA for 5±0.5 Min. with ultrasonic

No deterioration of

coatings and markings

Periodic-pulse Overload

IEC 60115-1 4.39

4 times RCWV 10,000 cycles (1 Sec. on,

25 Sec.off)

±1.0%+0.05Ω

Damp Heat Steady State

IEC 60115-1 4.24

40±2°C,90-95% RH for 56 days, loaded

with 0.1 times RCWV

±2.0%+0.05Ω

Endurance at 70°C

IEC 60115-1 4.25

70±2°C at RCWV(or Umax., whichever

less) for 1,000 Hr.(1.5 Hr.on,0.5 Hr. off)

±2.0%+0.05Ω

Temperature Cycling

IEC 60115-1 4.19



-55°C  Room Temp. 

+155°C Room Temp.(5 cycles)

±0.75%+0.05Ω

Resistance to Soldering

Heat

IEC 60115-1 4.18

260±3°C for 10±1 Sec., immersed to a

point 3±0.5mm from the body

±0.5%+0.05Ω