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V1.0

28/07/23

Thick Film Chip Resistors

Newark.com/multicomp-pro

Farnell.com/multicomp-pro

sg.element14.com/b/multicomp-pro

Characteristics

Limits

Test Methods

(AEC - Q200)

Biased Humidity

Resistance change rate is

1%: ± (1.0%+0.1Ω) Max.

5%: ± (3.0%+0.1Ω) Max.

10% rated power, 85°C/85%RH, 1000H,Measurement at 24

hours after test conclusion.

(MIL-STD-202 Method 103)

Mechanical Shock

Resistance change rate is

±(1.0%+0.1Ω)max

Wave Form: Tolerance for half sine shock pulse. Peak value

is 100g’s. Normal duration (D) is 6.

(MIL-STD-202 Method 213)

Vibration

Resistance change rate is

±(1.0%+0.1Ω)max

5g’s for 20 min., 12cycle each of 3 orientations.

Note: Use 8”*5”PCB. 031” thick 7 secure points (onone) long

side and 2 secure points at corners of opposite sides. Parts

mounted within 2’ from any secure point. Test from

10-2000Hz. (MIL-STD-202 Method 204)

Thermal Shock

Resistance change rate is

±(1.0%+0.1Ω)max

-55°C/+155°C,Note: Number of cycles required -300,

Maximum transfer time -20 seconds, Dwell time -15 minutes.

Air-Air. (MIL-STD-202 Method 107)

ESD

Resistance change rate is

±(10%+0.1Ω)max

With the electrometer in direct contact with the discharge

tip, verify the voltage setting at levels of ±500V,±1KV, ±2KV,

±4KV, ±8KV, The electrometer reading shall be within ±10%

for voltages from 500V to 800V.

(AEC-Q200-002)

Solderability

95% coverage Min.

For both leaded & SMD. Electrical test not required.

Magnification 50X. Conditions:

a) Method B 4hrs at 155°C dry heat, the dip in bath with

245°C,5s.

b) Method B: at 215°C,5s.

c) Method D: at 260°C, 60s.

( J-STD-002)

Flammability

No ignition of the tissue paper

or scorching or the pinewood

board

V-0 or V-1 are acceptable. Electrical test not required. (UL-94)

Board Flex

Resistance change rate is

±(1%+0.05Ω)max

2mm (Min)

(JIS-C-6429)

Flame Retardance

No flame

Temperature sensing at 500°C, Voltage power subjected to

32V DC current clamped up to 500A DC and decreased in

1.0V DC/hour.

(AEC-Q200-001)

Resistance to Soldering

Heat

Resistance change rate is

±(1%+0.05Ω)max.

Condition B No per-heat of samples. Note: Single Wave

Solder-Procedure 2 for SMD and Procedure 1 for Leaded with

solder within 1.5mm of device body.

(MIL-STD-202 Method 210)

* Sulfuration test: H2S 3~5PPM 50°C±2°C 91%~93%RH 1000H