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TLV702-Q1

SLVSC35D – AUGUST 2013 – REVISED JULY 2019

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Copyright © 2013–2019, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 4

6

Specifications......................................................... 5

6.1

Absolute Maximum Ratings ...................................... 5

6.2

ESD Ratings.............................................................. 5

6.3

Recommended Operating Conditions ....................... 5

6.4

Thermal Information .................................................. 5

6.5

Electrical Characteristics........................................... 6

6.6

Typical Characteristics .............................................. 7

7

Detailed Description ............................................ 11

7.1

Overview ................................................................. 11

7.2

Functional Block Diagrams ..................................... 11

7.3

Feature Description................................................. 11

7.4

Device Functional Modes........................................ 12

8

Application and Implementation ........................ 13

8.1

Application Information............................................ 13

8.2

Typical Application .................................................. 13

9

Power Supply Recommendations ...................... 15

9.1

Power Dissipation ................................................... 15

10

Layout................................................................... 15

10.1

Layout Guidelines ................................................. 15

10.2

Layout Examples................................................... 16

11

Device and Documentation Support ................. 17

11.1

Device Support .................................................... 17

11.2

Documentation Support ........................................ 17

11.3

Receiving Notification of Documentation Updates 17

11.4

Community Resources.......................................... 17

11.5

Trademarks ........................................................... 17

11.6

Electrostatic Discharge Caution ............................ 17

11.7

Glossary ................................................................ 18

12

Mechanical, Packaging, and Orderable

Information ........................................................... 18

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision C (January 2018) to Revision D

Page

•

Changed OUT pin number from 5 to 3 in DSE column of Pin Functions table ..................................................................... 4

•

Added footnote to maximum EN voltage specification .......................................................................................................... 5

•

Added parameter names to Recommended Operating Conditions table............................................................................... 5

Changes from Revision B (June 2015) to Revision C

Page

•

Added DBV package to document ......................................................................................................................................... 1

•

Changed Packages Features bullet to include DBV package ............................................................................................... 1

•

Added DBV package to Pin Configuration and Functions section ......................................................................................... 4

•

Added DBV column to Thermal Information table .................................................................................................................. 5

•

Changed title of Layout Example for the DDC and DBV Packages figure to include DBV package ................................... 16

Changes from Revision A (August 2013) to Revision B

Page

•

Added DSE (6-Pin WSON) package to data sheet ................................................................................................................ 1

•

Added Device Information, ESD Ratings, and Recommended Operating Conditions tables, and Detailed

Description, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation

Support, and Mechanical, Packaging, and Orderable Information sections to data sheet .................................................... 1

•

Deleted all references to P version of device throughout data sheet..................................................................................... 1

•

Added "Over Temperature" to 2% accuracy Features bullet ................................................................................................ 1

•

Changed DDC package name from TSOT23 to SOT throughout data sheet ........................................................................ 1

•

Changed Applications bullets ................................................................................................................................................. 1

•

Changed Description section text........................................................................................................................................... 1

•

Changed ceramic capacitor units on Typical Application circuit from mF to µF (typo) ......................................................... 1

•

Changed "free-air temperature" to "junction temperature" in Absolute Maximum Ratings condition statement .................... 5

•

Added TJ to TA condition in Electrical Characteristics condition statement............................................................................ 6