ABSOLUTE MAXIMUM RATINGS

DISSIPATION RATINGS

THERMAL CHARACTERISTICS

SN75DP118

SLLS916B – SEPTEMBER 2008 – REVISED APRIL 2009 ................................................................................................................................................ www.ti.com

ORDERING INFORMATION

PART NUMBER

PART MARKING

PACKAGE(1)

SN75DP118RHHR

DP118

36-pin QFN Reel (large)

SN75DP118RHHT

DP118

36-pin QFN Reel (small)

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

over operating free-air temperature range (unless otherwise noted)

(1)

VALUE

UNIT

Supply Voltage Range(2)

VCC, VDD

–0.3 to 5.5

V

Main Link I/O (ML_IN x, ML_OUT x) Differential Voltage

1.5

V

Voltage Range

HPD and CAD I/O

–0.3 to VCC + 0.3

V

Control I/O

–0.3 to VCC + 0.3

V

Human body model(3)

±12000

V

Electrostatic discharge

Charged-device model(4)

±1000

V

Machine model(5)

±200

V

Continuous power dissipation

See Dissipation Rating Table

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions

is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values, except differential voltages, are with respect to network ground terminal.

(3)

Tested in accordance with JEDEC Standard 22, Test Method A114-B.

(4)

Tested in accordance with JEDEC Standard 22, Test Method C101-A.

(5)

Tested in accordance with JEDEC Standard 22, Test Method A115-A.

DERATING FACTOR(1)

TA = 85°C

PACKAGE

PCB JEDEC STANDARD

TA < 25°C

ABOVE TA = 25°C

POWER RATING

Low-K

759 mW

7.5 mW/°C

303 mW

36-pin QFN (RHH)

High-K

2127 mW

21.2 mW/°C

851 mW

(1)

This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX(1)

UNIT

RθJB

Junction-to-board thermal resistance

4x4 Thermal vias under powerpad

28.11

°C/W

RθJC

Junction-to-case thermal resistance

32.77

°C/W

LP = 5.5 V; ML: VPP = 1200 mV, 2.7 Gbps,

PRBS; HPD_IN/CAD_IN/CAD_INV = 5.5 V;

PD

Device power dissipation

240

280

mW

VCC = 5.5 V,

VDD = 5.25 V; Temp = 85°C; DPadj = 6.49 kΩ

LP = 0V; HPD_IN/CAD_IN/CAD_INV = 5.5V ;

Device power dissipation under low

VCC = 5.5V ,

PSD

40

µW

power

VDD = 5.2 V; Temp = 85°C; DPadj = 6.49 kΩ

(1)

Maximum Rating is simulated under worse case condition.

4

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