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PTH12010x

(Top View)

1

2

10

7

6

5

4

3

MarginUp

MarginDown

VI

L

O

A

D

C

560 F

(Required)

I

m

R

,1%

(Required)

SET

C

330 F

(Optional)

O

m

Inhibit

GND

GND

VO

VOSense

Track

9

8

ABSOLUTE MAXIMUM RATINGS

PTH12010W, PTH12010L

SLTS205G – JUNE 2003 – REVISED FEBRUARY 2007

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

STANDARD APPLICATION

A.

RSET = Required to set the output voltage to a value higher than the lowest value (see the electrical characteristics

table for values).

ORDERING INFORMATION

For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or see

the TI website at www.ti.com.

Voltages are with respect to GND

MIN

TYP

MAX

UNIT

Vtrack

Track Input Voltage

–0.3

VI + 0.3

V

TA

Operating Temperature

Over VI Range

–40 (1)

85

°C

Range

Twave

Wave solder

Surface temperature of module body or pins

PTH12010WAH

260 (2)

temperature

(5 seconds)

°C

PTH12010WAS

235 (2)

Solder reflow

Treflow

Surface temperature of module body or pins

temperature

PTH12010WAZ

260 (2)

Tstg

Storage Temperature

–55

125 (3)

°C

Mechanical Shock

Per Mil-STD-883D, Method 2002.3, 1 msec, 1/2 Sine, mounted

500

G

Mechanical Vibration

Mil-STD-883D, Method 2007.2

20

G

20-2000 Hz

Weight

5

grams

Flammability

Meets UL 94V-O

(1)

For operation below 0

°C the external capacitors must have stable characteristics. Use either a low-ESR tantalum, Os-Con, or ceramic

capacitor.

(2)

During soldering of package version, do not elevate peak temperature of the module, pins or internal components above the stated

maximum.

(3)

The shipping tray or tape and reel cannot be used to bake parts at temperatures higher than 65°C.

2

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