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LSF0102 датащи(PDF) 4 Page - Texas Instruments

номер детали LSF0102
подробное описание детали  LSF0102-Q1 Automotive 2-Channel Auto Bidirectional Multi-Voltage Level Translator
PDF  27 Pages
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производитель  TI2 [Texas Instruments]
домашняя страница  https://www.ti.com
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LSF0102 датащи(HTML) 4 Page - Texas Instruments

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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature (unless otherwise noted)(1)
MIN
MAX
UNIT
Input voltage(2), VI
–0.5
7
V
Input/output voltage(2), VI/O
–0.5
7
V
Continuous channel current
128
mA
Input clamp current, IIK
VI < 0
–50
mA
Storage temperature range, Tstg
–65
150
°C
Operating junction temperature, TJ
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The input and input/output negative-voltage ratings may be exceeded if the input and input/output clamp-current ratings are observed.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per AEC Q100-002(1)
±2000
V
Charged-device model (CDM), per AEC Q100-011
±1000
(1)
AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VI/O
Input/output voltage
5.5
V
Vref_A/B/EN
Reference voltage
5.5
V
IPASS
Pass transistor current
64
mA
TA
Operating free-air temperature
–40
125
°C
6.4 Thermal Information
THERMAL METRIC(1)
LSF0102-Q1
UNIT
DCU (US8)
8 PINS
RθJA
Junction-to-ambient thermal resistance
279.7
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
129.9
°C/W
RθJB
Junction-to-board thermal resistance
191.3
°C/W
ψJT
Junction-to-top characterization parameter
66.3
°C/W
ψJB
Junction-to-board characterization parameter
190.1
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.
LSF0102-Q1
SDLS969B – MAY 2018 – REVISED MAY 2023
www.ti.com
4
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Copyright © 2023 Texas Instruments Incorporated
Product Folder Links: LSF0102-Q1



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