LMZ22010

SNVS687H – MARCH 2011 – REVISED AUGUST 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

MIN

MAX

UNIT

VIN to PGND

–0.3

24

V

EN, SYNC to AGND

–0.3

5.5

V

SS, FB, SH to AGND

–0.3

2.5

V

AGND to PGND

–0.3

0.3

V

Junction Temperature

150

°C

Peak Reflow Case Temperature (30 sec)

245

°C

Storage Temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

For soldering specifications, refer to the following document: SNOA549

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2)

±2000

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

The human body model is a 100-pF capacitor discharged through a 1.5-k

Ω resistor into each pin. Test method is per JESD-22-114.

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

VIN

6

20

V

EN, SYNC

0

5

V

Operation Junction Temperature

−40

125

°C

6.4 Thermal Information

LMZ22010

THERMAL METRIC(1)

NDY

UNIT

11 PINS

Natural Convection

9.9

Junction-to-ambient thermal

RθJA

225 LFPM

6.8

°C/W

resistance(2)

500 LFPM

5.2

RθJC(top)

Junction-to-case (top) thermal resistance

1.0

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

Theta JA measured on a 3.0-in x 3.5-in 4-layer board, with 2-oz. copper on outer layers and 1-oz. copper on inner layers, two hundred

and ten thermal vias, and 2-W power dissipation. Refer to evaluation board application note layout diagrams.

4

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