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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

Outline Drawing

Specifications and data reflect HMC461LP3 measured with external baluns in a balanced

amplifier configuration optimized for 1.85 - 2.2 GHz per application circuit herein.

Contact HMC Applications for 1.7 - 1.85 GHz performance optimization.

NOTES:

1. LEADFRAME MATERIAL: COPPER ALLOY

2. DIMENSIONS ARE IN INCHES [MILLIMETERS]

3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE

4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.

PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.

5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.

6. ALL GROUND LEADS AND GROUND PADDLE MUST BE

SOLDERED TO PCB RF GROUND.

7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED

LAND PATTERN.

Part Number

Package Body Material

Lead Finish

MSL Rating

Package Marking

[3]

HMC461LP3

Low Stress Injection Molded Plastic

Sn/Pb Solder

MSL1

[1]

461

XXXX

HMC461LP3E

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

MSL1

[2]

461

XXXX

[1] Max peak reflow temperature of 235 °C

[2] Max peak reflow temperature of 260 °C

[3] 4-Digit lot number XXXX

Package Information

InGaP HBT 1 Watt High IP3

AMPLIFIER, 1.7 - 2.2 GHz

v02.0705