5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range unless otherwise noted(1)

MIN

MAX

UNITS

VCC

Supply voltage range(2)

–0.5

4

V

VI

Input voltage range

A, EN, EN

–0.5

4

V

VO

Output voltage range

Y, Z

–1.8

4

V

TJ

Junction temperature

140

°C

PD

Device power dissipation

EN = VCC, EN = GND, RL = 50Ω, Input 100MHz 50 %

duty cycle square wave to 1A:4A, TA = 85°C

288.5

mW

Tstg

Storage Temperature

–65

150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values, except differential I/O bus voltages, are with respect to the circuit ground terminal.

5.2 ESD Ratings

VALUE

UNIT

V (ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/

ESDA/JEDEC JS-001(1)

Y and Z

±9000

V

All pins

±4000

Charged device model (CDM), per AEC

Q100-011(2)

All pins

±1500

Machine Model

All pins

±200

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

see Figure 6-1

MIN

NOM

MAX

UNIT

VCC

Supply voltage

3

3.3

3.6

V

VIH

High-level input voltage

2

VCC

V

VIL

Low-level input voltage

0

0.8

V

Voltage at any bus terminal (separate or common mode) VY or VZ

–1.4

3.8

V

RL

Differential load resistance

30

55

Ω

1/tUI

Signaling rate

200

Mbps

Clock frequency

100

MHz

TJ

Junction temperature

–40

125

°C

5.4 Package Dissipation Ratings

PACKAGE

PCB JEDEC

STANDARD

TA ≤ 25°C

POWER RATING

DERATING FACTOR

ABOVE TA = 25°C(1)

TA = 85°C

POWER RATING

D(16)

Low-K(2)

898mW

7.81mW/°C

429mW

PW(16)

Low-K(2)

592mW

5.15mW/°C

283mw

High-K(3)

945mW

8.22mW/°C

452mw

(1)

This is the inverse of the junction-to-ambient thermal resistance when board mounted and with no air flow.

(2)

In accordance with the Low-K thermal metric definitions of EIA/JESD51-3.

(3)

In accordance with the High-K thermal metric definitions of EIA/JESD51-7.

SN65MLVD047A

SLLS736B – JULY 2006 – REVISED MARCH 2024

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