0

1

2

3

4

5

0.0

0.2

0.4

0.6

0.8

1.0

1.2

VIN- VOUT(V)

TA= 75°C

TA= 50°C

TA= 25°C

For TJ= 150°C and JA= 50°C/W

-50

-25

0

25

50

75

100 125

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

AMBIENT TEMPERATURE, TA(°C)

JA= 50°C/W

JA= 56°C/W

JA= 65°C/W

JA= 131°C/W

LP38869

SNVS877B – AUGUST 2012 – REVISED APRIL 2013

www.ti.com

Figure 36. Maximum Dissipation vs. Ambient Temperature

Figure 37 shows the allowable power dissipation factors for a typical multi-layer PC board at ambient

temperatures of +25°C, +50°C, and +70°C for the AbsMax junction temperature of 150°C.

Figure 37. Maximum Output Current vs Input-Output Differential Voltage

The LP38869 HTSSOP package features an exposed thermal pad on its underside. This exposed pad lowers the

package’s thermal resistance by providing a direct thermal heat path from the die to the PC board. Connect the

exposed thermal pad to circuit ground using a large copper pad (1 square inch is the recommended minimum),

or use multiple thermal vias to the ground plane of a multi-layer PCB.

For the LP38869MH in the HTSSOP Exposed Pad 16-Lead package, the junction-to-case thermal rating,

θJC, is

16.2°C/W, where the case is the bottom of the package at the center of the Exposed Pad. Typical junction-to-

ambient thermal performance for the LP38869MH, using the JESD51 standards, is summarized in the following

table.

16

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