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ADC12DL080 датащи(PDF) 23 Page - Texas Instruments |
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ADC12DL080 датащи(HTML) 23 Page - Texas Instruments |
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23 / 33 page ![]() DtHD Valid Data DtSUD DtPLD DtPHD Valid Data 16 th clock SCLK SDI SVA-30206510 LMH6523 www.ti.com SNOSC88 – DECEMBER 2012 Figure 55. Write Timing – Data Written to SDI Pin Table 5. Write Timing Data Input on SDI Pin PARAMETER DESCRIPTION tPL Minimum clock low time (clock duty dycle) tPH Minimum clock high time (clock duty cycle) tSU Input data setup time tH Input data hold time Table 6. Serial Word Format for LMH6523 C7 C6 C5 C4 C3 C2 C1 C0 1= read 0 0 0 0 000= CHA 0=write 001=CHB 010=CHC 011=CHD 100=Fast Adjust Table 7. CH A through D Register Definition 7 6 5 4 3 2 1 0 Reserved, =0 Reserved Reserved Attenuation Setting: 00000 = Maximum Gain 11111 = Minimum Gain Table 8. Fast Adjust Register Definition 7 6 5 4 3 2 1 0 CH D CH C CH B CH A Table 9. Fast Adjust Codes CODE ACTION 00 No Change 01 Decrease Attenuation by 1 Step (1dB) 10 Increase Attenuation by 1 Step (1dB) 11 Reserved, action undefined THERMAL MANAGEMENT The LMH6523 is packaged in a thermally enhanced package. The exposed pad is connected to the GND pins. It is recommended, but not necessary, that the exposed pad be connected to the supply ground plane. In any case, the thermal dissipation of the device is largely dependent on the attachment of this pad to the system printed circuit board (PCB). The exposed pad should be attached to as much copper on the PCB as possible, preferably external copper. However, it is also very important to maintain good high speed layout practices when designing a system board. Please refer to the LMH6522 evaluation board (available separately) for suggested layout techniques. Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 23 Product Folder Links: LMH6523 |
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