LMC7221

SNOS748E – SEPTEMBER 1999 – REVISED MARCH 2013

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Absolute Maximum Ratings

(1)

ESD Tolerance (2)

2 kV

Differential Input Voltage

V+ +0.3V, V−

−0.3V

Voltage at Input

V+ +0.3V, V−

−0.3V

Voltage at Output Pin

15V

Supply Voltage (V+–V−)

16V

Current at Input Pin (3)

±5 mA

Current at Output Pin(4) (5)

±30 mA

Current at Power Supply Pin

40 mA

Lead Temperature (soldering, 10 sec.)

260°C

Junction Temperature (6)

150°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics.

(2)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of

JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).

(3)

All limits are specified by testing or statistical analysis.

(4)

Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in

exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±30 mA may adversely affect reliability.

(5)

Limiting input pin current is only necessary for input voltages which exceed the absolute maximum input voltage rating.

(6)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board.

Operating Ratings

(1)

Supply Voltage

2.7

≤ VCC ≤ 15V

Temperature Range (2)

LMC7221AI, LMC7221BI

−40°C to +85°C

Thermal Resistance (

θJA)

8-Pin SOIC

180°C/W

5-Pin SOT-23

325°C/W

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics.

(2)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board.

2.7V Electrical Characteristics

Unless otherwise specified, all limits ensured for TJ = 25°C, V

+ = 2.7V, V− = 0V, V

CM = VO = V

+/2. Boldface limits apply at the

temperature extremes.

Parameter

Test Conditions

LMC7221AI

LMC7221BI

Units

Typ(1)

Limit(2)

Limit(2)

VOS

Input Offset Voltage

3

5

15

mV

8

18

max

TCVOS

Input Offset Voltage

1.0

μV/°C

Temperature Drift

Input Offset Voltage Average

(3)

3.3

μV/Month

Drift

IB

Input Current

0.04

pA

IOS

Input Offset Current

0.02

pA

CMRR

Common Mode Rejection Ratio

0V

≤ VCM ≤ 2.7V

75

dB

PSRR

Power Supply Rejection Ratio

2.7V

≤ V+ ≤ 15V

80

dB

(1)

Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary

over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped

production material.

(2)

All limits are specified by testing or statistical analysis.

(3)

CL includes the probe and test jig capacitance.

2

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