LM48413

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SNAS460B – NOVEMBER 2008 – REVISED MARCH 2013

Connection Diagram

Figure 3. 18 bump DSBGA package

Top View

See Package Number YZR0018

BUMP DESCRIPTIONS

Bump

Name

Description

A1

INL-

Left Channel Inverting Input

A3

3DEN

3D Enable Input

A5

OUTLA

Left Channel Non-Inverting Output

A7

OUTLB

Left Channel Inverting Output

B2

INL+

Left Channel Non-Inverting Input

B4

3DL-

Left Channel inverting 3D connection. Connect to 3DR- through C3D-and R3D-

B6

GND

Ground

C1

3DL+

Left Channel non-inverting 3D connection. Connect to 3DR+ through C3D+ and R3D+

C3

3DR+

Right Channel non-inverting 3D connection. Connect to 3DL+ through C3D+ and R3D+

C5

VDD

Power Supply. Connect to PVDD supplying same voltage.

C7

PGND

Power Ground

D2

INR+

Right Channel Non-inverting Input

D4

3DR-

Right Channel inverting 3D connection. Connect to 3DL- through C3D-and R3D-

D6

PVDD

Amplifier Power Supply

E1

INR-

Right Channel Inverting Input

E3

SD

Connect to GND for disabling the device. Connect to VDD for normal operation.

E5

OUTRA

Right Channel Non-inverting Output

E7

OUTRB

Right Channel Inverting Output

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

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