LM27313, LM27313-Q1

SNVS487E – DECEMBER 2006 – REVISED JANUARY 2015

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6.3 ESD Ratings: LM27313-Q1

VALUE

UNIT

Human body model (HBM), per AEC Q100-002(1)

±2000

V(ESD)

Electrostatic discharge

Corner pins (1, 3, 4, and 5)

±1000

V

Charged device model (CDM), per

AEC Q100-011

Other pins

±1000

(1)

AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.4 Recommended Operating Conditions

MIN

NOM

MAX UNIT

VIN

2.7

14

V

VSW(MAX)

30

V

VSHDN

0

VIN

V

Junction Temperature, TJ

–40

125

°C

6.5 Thermal Information

LM27313,

LM27313-Q1

THERMAL METRIC(1)

UNIT

DBV

5 PINS

RθJA

Junction-to-ambient thermal resistance

166.3

RθJC(top)

Junction-to-case (top) thermal resistance

71.8

RθJB

Junction-to-board thermal resistance

28.1

°C/W

ψJT

Junction-to-top characterization parameter

2.1

ψJB

Junction-to-board characterization parameter

27.7

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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