5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VCC

Supply voltage range

-0.5

7

V

IIK

Input clamp current

(VI < -0.5 V or VI > VCC + 0.5 V)

±20

mA

IOK

Output clamp current

(VO < -0.5 V or VO > VCC + 0.5 V)

±20

mA

IO

Continuous output current

(-0.5 V < VO < VCC + 0.5 V)

±35

mA

Continuous current through VCC or GND

±50

mA

TJ

Junction temperature

150

°C

Tstg

Storage temperature

-65

150

°C

Lead Temperature (Soldering 10s)

300

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

5.2 Recommended Operating Conditions

MIN

MAX

UNIT

TA

Temperature range

–55

125

℃

VCC

Supply voltage range

HC Types

2

6

V

HCT Types

4.5

5.5

V

VI,VO

Input or output voltage

0

VCC

V

tt

Input rise and fall time

2 V

1000

ns

4.5 V

500

ns

6 V

400

ns

5.3 Thermal Information

THERMAL METRIC

D (SOIC)

N (PDIP)

UNIT

16 PINS

16 PINS

RθJA

Junction-to-ambient thermal resistance

(1)

73

67

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application

report.

CD54HC367, CD74HC367, CD54HCT367

CD74HCT367, CD54HC368, CD74HC368, CD74HCT368

SCHS181E – NOVEMBER 1997 – REVISED FEBRUARY 2022

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