5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VCC

Supply voltage range

–0.5

6

V

IIK

Input clamp current

(VI < 0 V or VI > VCC) (2)

±20

mA

IOK

Output clamp current

(VO < 0 V or VO > VCC)

(2)

±50

mA

IO

Continuous output current

(VO> 0 V or VO < VCC)

±50

mA

Continuous current through VCC or GND

±200

mA

Tstg

Storage temperature range

–65

150

°C

(1)

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating

conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±2000

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)

TA = 25°C

–55°C to 125°C

–40°C to 85°C

UNIT

MIN

MAX

MIN

MAX

MIN

MAX

VCC

Supply voltage

4.5

5.5

4.5

5.5

4.5

5.5

V

VIH

High-level input voltage

2

2

2

V

VIL

Low-level input voltage

0.8

0.8

0.8

V

VI

Input voltage

0

VCC

0

VCC

0

VCC

V

VO

Output voltage

0

VCC

0

VCC

0

VCC

V

IOH

High-level output current

–24

‐24

‐24

mA

IOL

Low-level output current

24

24

24

mA

Δt/Δv

Input transition rise or fall rate

10

10

10

ns/V

(1)

All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

5.4 Thermal Information

THERMAL METRIC

N (PDIP)

D (SOIC)

UNIT

16 PINS

16 PINS

RθJA

Junction-to-ambient thermal resistance

67

106.6

°C/W

CD74ACT175

SCHS345A – APRIL 2003 – REVISED MAY 2024

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