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PACKAGE OUTLINE

C

2.65

2.29

0.5

0.3

TYP

15.2

TYP

15.2 TYP

0.8 TYP

0.8 TYP

400X

0.55

0.45

0.76

0.56

(1.4)

A

17.2

16.8

B

17.2

16.8

(0.9) TYP

(

16)

FCBGA - 2.65 mm max height

ALK0400A

BALL GRID ARRAY

4225930/C 03/2023

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.

4. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.

5. Pb-Free die bump and SnPb solder ball.

6. The lids are electrically floating (e.g. not tied to GND).

BALL A1 CORNER

SEATING PLANE

BALL TYP

0.12 C

NOTE 4

0.2 C

W

U

R

N

L

J

G

E

C

A

1

2

3

0.15

C A B

0.08

C

SYMM

SYMM

4

NOTE 3

5

6

7

8

9

10

11

12

13

14

15

17

19

16

18

20

Y

V

T

P

M

K

H

F

D

B

SCALE 0.750