TMP422

DX1

(4)

DX2

(4)

5

2

1

R

S

(2)

R

S

(2)

C

DIFF

(3)

C

DIFF

(3)

R

S

(2)

R

S

(2)

GND

Diode-connectedconfiguration :

(1)

SeriesResistance

Transistor-connectedconfiguration :

(1)

DX3

(4)

DX4

(4)

4

3

R

S

(2)

R

S

(2)

C

DIFF

(3)

0.1 F

m

10kW

(typ)

10kW

(typ)

V+

8

7

6

SCL

SDA

+5V

SMBus

Controller

DXP1

DXN1

DXP2

DXN2

+5V

TMP423

DXP1

DXP2

DXP3

DXP

DXN

DXN

SCL

GND

SDA

V+

2

3

4

7

1

6

8

R

S

(2)

R

S

(2)

R

S

(2)

R

S

(2)

R

S

(2)

R

S

(2)

C

DIFF

(3)

C

DIFF

(3)

C

DIFF

(3)

Transistor-connectedconfiguration :

(1)

C

DIFF

(3)

R

S

(2)

R

S

(2)

Diode-connectedconfiguration :

(1)

5

0.1 F

m

10kW

(typ)

10kW

(typ)

SMBus

Controller

SeriesResistance

TMP421

TMP422

TMP423

SBOS398C – JULY 2007 – REVISED MAY 2012

www.ti.com

(1) Diode-connected configuration provides better settling time. Transistor-connected configuration provides better series resistance

cancellation.

(2) RS (optional) should be < 1.5kΩ in most applications. Selection of RS depends on application; see the Filtering section.

(3) CDIFF (optional) should be < 1000pF in most applications. Selection of CDIFF depends on application; see the Filtering section and

Figure 6, Remote Temperature Error vs Differential Capacitance.

(4) TMP422 SMBus slave address is 1001 100 when connected as shown.

Figure 12. TMP422 Basic Connections

(1) Diode-connected configuration provides better settling time. Transistor-connected configuration provides better series resistance

cancellation.

(2) RS (optional) should be < 1.5kΩ in most applications. Selection of RS depends on application; see the Filtering section.

(3) CDIFF (optional) should be < 1000pF in most applications. Selection of CDIFF depends on application; see the Filtering section and

Figure 6, Remote Temperature Error vs Differential Capacitance.

Figure 13. TMP423 Basic Connections

10

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