2

TMP709

SBOS583B – DECEMBER 2011 – REVISED DECEMBER 2016

www.ti.com

Product Folder Links: TMP709

Submit Documentation Feedback

Copyright © 2011–2016, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 4

6.1

Absolute Maximum Ratings ...................................... 4

6.2

ESD Ratings.............................................................. 4

6.3

Recommended Operating Conditions ....................... 4

6.4

Thermal Information .................................................. 4

6.5

Electrical Characteristics........................................... 5

6.6

Typical Characteristics .............................................. 6

7

Detailed Description .............................................. 7

7.1

Overview ................................................................... 7

7.2

Functional Block Diagram ......................................... 7

7.3

Feature Description................................................... 8

7.4

Device Functional Modes.......................................... 8

8

Applications and Implementation ........................ 9

8.1

Application Information.............................................. 9

8.2

Typical Application ................................................... 9

9

Power Supply Recommendations ...................... 11

10

Layout................................................................... 11

10.1

Layout Guidelines ................................................. 11

10.2

Layout Example .................................................... 11

10.3

Thermal Considerations ........................................ 11

11

Device and Documentation Support ................. 12

11.1

Receiving Notification of Documentation Updates 12

11.2

Community Resources.......................................... 12

11.3

Trademarks ........................................................... 12

11.4

Electrostatic Discharge Caution ............................ 12

11.5

Glossary ................................................................ 12

12

Mechanical, Packaging, and Orderable

Information ........................................................... 12

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision A (February 2012) to Revision B

Page

•

Added Device Information, ESD Ratings, and Recommended Operating Conditions tables, and Detailed

Description, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation

Support, and Mechanical, Packaging, and Orderable Information sections........................................................................... 1

•

Deleted Package and Ordering Information table; information now available in package option addendum located at

the end of this data sheet ...................................................................................................................................................... 2

Changes from Original (December 2011) to Revision A

Page

•

Updated threshold accuracy feature bullet ............................................................................................................................ 1

•

Updated threshold accuracy text in second paragraph of Description section ...................................................................... 1

•

Updated temperature error parameter in the Electrical Characteristics ................................................................................. 5