D+

D

SCL

SDA

THERM

GND

V+

ALERT / THERM2

SMBus

Controller

1

2

3

4

5

8

7

6

TMP451

1.7 V to 3.6 V

1.7 V to 3.6 V

Overtemperature Shutdown

RS

(2)

RS

(2)

RS

(2)

RS

(2)

0.1 µF

10 k

(typ)

10 k

(typ)

10 k

(typ)

10 k

(typ)

CDIFF

(3)

CDIFF

(3)

Transistor-connected configuration

(1)

Diode-connected configuration

(1)

Series Resistance

TMP451

www.ti.com

SBOS686A – JUNE 2013 – REVISED DECEMBER 2014

8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

8.1 Application Information

The TMP451 device requires only a transistor connected between the D+ and D– pins for remote temperature

measurement. Tie the D+ pin to GND if the remote channel is not used and only the local temperature is

measured. The SDA, ALERT, and THERM pins (and SCL, if driven by an open-drain output) require pullup

resistors as part of the communication bus. A 0.1-µF power-supply decoupling capacitor is recommended for

local bypassing.

8.2 Typical Application

Figure 41 shows the typical configuration for the TMP451 device.

(1) Diode-connected configuration provides better settling time. Transistor-connected configuration provides better series resistance

cancellation.

(2) RS (optional) should be < 1 kΩ in most applications. Selection of RS depends on application; see the Filtering section.

(3) CDIFF (optional) should be < 1000 pF in most applications. Selection of CDIFF depends on application; see the Filtering section and

Figure 6.

Figure 41. TMP451 Basic Connections Using a Discrete Remote Transistor

Copyright © 2013–2014, Texas Instruments Incorporated

Submit Documentation Feedback

29

Product Folder Links: TMP451